Packaging IC Engineer

  • full time
  • 2+ years
  • Sharon area

Job Description:

For a hi-tech company developing products in the field of energy production, with offices in the Sharon, we are lookinf for Packaging IC Engineer.
In this highly important role, you will own and drive advanced package/power module development, new product package structure and configuration optimization. You will be responsible for package/SIP/power module layout, optimization, design verification and tape-out.
Responsibilities:
Power modules and standard IC packaging design.
Package/Module substrate design using Cadence Allegro Package Designer.
Communication with package houses in Far East.
Working closely with digital and analog teams.



Category:

Hardware

Job Qualifications:

Must have good EE fundamentals.
Must have solid signal and power integrity fundamentals.
Experience in package/power modules design.
Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry.
Power design back-ground is a strong advantage.
Experience with Cadence SIP is an advantage.
Silicon operation and packaging mechanics/power/electronics



Company Occupation:

Cleantech, High Tech, Multidisciplinary

Company Size:

Large (150+)

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